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Semiconductor Fundamentals·Technology & Systems
packaging

packaging

/ˈpækɪdʒɪŋ/

⚡ Semiconductor Fundamentals

encasing a die in a protective housing with electrical connections to the outside world

packaging in a sentence

“Advanced packaging techniques like chiplet stacking have become a key competitive battleground.”

Origin of packaging

From pack + -age; the act of enclosing something for protection

Related Words

thermal envelope

the maximum amount of heat a chip is designed to dissipate under sustained load, measured in watts

EDA

Electronic Design Automation; software tools used to design, simulate, and verify integrated circuits before manufacturing

reticle

the photomask containing one or more chip patterns, used in a stepper to expose those patterns onto a wafer

IDM

Integrated Device Manufacturer; a semiconductor company that both designs and manufactures its own chips

HBM

High Bandwidth Memory; a stacked DRAM technology that places memory dies directly atop or beside a processor for extreme data throughput

back-end-of-line

the stage of chip fabrication that creates the metal interconnect layers connecting transistors to each other

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